BFR93AW NPN Silicon RF Transistor * For low distortion amplifiers and oscillators up to 2 GHz at collector currents from 3 2 5 mA to 30 mA 1 * Pb-free (RoHS compliant) package * Qualification report according to AEC-Q101 available ESD (Electrostatic discharge) sensitive device, observe handling precaution! Type BFR93AW Marking R2s Pin Configuration 1=B 2=E Package SOT323 3=C Maximum Ratings at TA = 25 C, unless otherwise specified Parameter Symbol Value Unit Collector-emitter voltage VCEO 12 Collector-emitter voltage VCES 20 Collector-base voltage VCBO 20 Emitter-base voltage VEBO 2 Collector current IC 90 Base current IB 9 Total power dissipation1) Ptot 300 mW Junction temperature TJ 150 C Ambient temperature TA -65 ... 150 Storage temperature TStg -65 ... 150 V mA TS 104 C Thermal Resistance Parameter Symbol Junction - soldering point2) RthJS 1T Value Unit 155 K/W S is measured on the collector lead at the soldering point to the pcb 2For calculation of R thJA please refer to Application Note AN077 (Thermal Resistance Calculation) 1 2012-07-18 BFR93AW Electrical Characteristics at T A = 25C, unless otherwise specified Symbol Parameter Values Unit min. typ. max. 12 - - V ICES - - 100 A ICBO - - 100 nA IEBO - - 10 A hFE 70 100 140 - DC Characteristics Collector-emitter breakdown voltage V(BR)CEO IC = 1 mA, I B = 0 Collector-emitter cutoff current VCE = 20 V, VBE = 0 Collector-base cutoff current VCB = 10 V, IE = 0 Emitter-base cutoff current VEB = 2 V, IC = 0 DC current gain IC = 30 mA, VCE = 8 V, pulse measured 2 2012-07-18 BFR93AW Electrical Characteristics at TA = 25C, unless otherwise specified Symbol Values Parameter Unit min. typ. max. 4.5 6 - Ccb - 0.58 0.8 Cce - 0.3 - Ceb - 1.9 - AC Characteristics (verified by random sampling) Transition frequency fT GHz IC = 30 mA, VCE = 8 V, f = 500 MHz Collector-base capacitance pF VCB = 10 V, f = 1 MHz, VBE = 0 , emitter grounded Collector emitter capacitance VCE = 10 V, f = 1 MHz, VBE = 0 , base grounded Emitter-base capacitance VEB = 0.5 V, f = 1 MHz, VCB = 0 , collector grounded Minimum noise figure dB NFmin IC = 5 mA, VCE = 8 V, ZS = ZSopt , f = 900 MHz - 1.5 - - 2.6 - - 15.5 - - 10.5 - IC = 5 mA, VCE = 8 V, ZS = ZSopt , f = 1.8 GHz Power gain, maximum available1) Gma IC = 30 mA, VCE = 8 V, ZS = ZSopt, ZL = ZLopt , f = 900 MHz IC = 30 mA, VCE = 8 V, ZS = ZSopt, ZL = ZLopt, f = 1.8 GHz |S21e|2 Transducer gain dB IC = 30 mA, VCE = 8 V, ZS = ZL = 50 , f = 900 MHz - 13 - IC = 30 mA, VCE = 8 V, ZS = ZL = 50 , f = 1.8 MHz - 7.5 - 1/2 ma = |S21e / S12e | (k-(k-1) ) 1G 3 2012-07-18 BFR93AW Total power dissipation P tot = (TS) Permissible Pulse Load RthJS = (tp) 10 3 400 mW K/W RthJS Ptot 300 250 10 2 200 150 0.5 0.2 0.1 0.05 0.02 0.01 0.005 D=0 10 1 100 50 0 0 20 40 60 80 100 120 C 10 0 -7 10 150 TS 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 tp Permissible Pulse Load Ptotmax/PtotDC = (tp ) P totmax/PtotDC 10 2 - D=0 0.005 0.01 0.02 0.05 0.1 0.2 0.5 10 1 10 0 -7 10 10 -6 10 -5 10 -4 10 -3 10 -2 s 10 0 tp 4 2012-07-18 Package SOT323 BFR93AW Package Outline 0.9 0.1 2 0.2 0.3 +0.1 -0.05 0.1 MAX. 3x 0.1 M 0.1 A 1 2 1.25 0.1 0.1 MIN. 2.1 0.1 3 0.15 +0.1 -0.05 0.65 0.65 0.2 M A Foot Print 0.8 1.6 0.6 0.65 0.65 Marking Layout (Example) Manufacturer 2005, June Date code (YM) BCR108W Type code Pin 1 Standard Packing Reel o180 mm = 3.000 Pieces/Reel Reel o330 mm = 10.000 Pieces/Reel 0.2 2.3 8 4 Pin 1 2.15 1.1 5 2012-07-18 BFR93AW Edition 2009-11-16 Published by Infineon Technologies AG 81726 Munich, Germany 2009 Infineon Technologies AG All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (<www.infineon.com>). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 6 2012-07-18